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WF6 Tungsten Hexafluoride Gas | Stable Supply for HBM, 3D NAND, Logic Chips

WF₆ Tungsten Hexafluoride gas for 3nm/5nm/7nm advanced logic, HBM, and 3D NAND manufacturing. Multiple cylinder sizes available, UN2196 compliant shipping. Batch-to-batch consistency guaranteed. Request a sample or quote today.

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Tungsten Hexafluoride (WF₆) - Product Detail Page

Product Name: Tungsten Hexafluoride (WF₆)
CAS Number: 7783-82-6
Molecular Formula: WF₆
Molecular Weight: 297.83 g/mol




Product Overview

Tungsten Hexafluoride (WF₆) is the only commercially viable precursor gas for chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes to deposit high-purity tungsten metal films in semiconductor manufacturing. As a critical specialty gas for advanced chip production, it is indispensable for building conductive bridges in nanoscale transistor structures, with no existing alternative for large-scale mass production. 3, 4

Key Applications

· Advanced Logic Chips: Contact hole filling and tungsten plug preparation for 7nm/5nm/3nm processes; single-wafer consumption for 3nm chips is 2.5x that of 28nm nodes. 3, 4

· 3D NAND Flash Memory: Filling vertical vias for high-layer stacks; 200+ layer stacks require 6N-grade purity, 500+ layer stacks require 7N-grade purity. 3, 4

· HBM (High Bandwidth Memory): Multi-layer interconnect structures make single-chip tungsten consumption 3x that of standard DRAM chips. 3, 4

· DRAM Memory: Used for capacitor structures and bitline conductive layers. 3, 4

· Other Applications: OLED/TFT-LCD panel electrode deposition, solar absorber manufacturing, X-ray emission electrode preparation, and high-purity tungsten material research. 4, 7

Technical Specifications

Parameter

Specification

Purity Grade

5N (99.999%), 6N (99.9999%), 7N (99.99999%)

Appearance

Colorless gas at room temperature, pale yellow liquid below 17.5℃

Boiling Point

17.5℃

Melting Point

2.3℃

Gas Density

12.4 g/L (25℃), ~10x denser than air

Liquid Density

3.44 g/cm³ (15℃)

Leak Rate

≤10⁻⁸ mbar·L/s (He)

Metal Impurity Content

≤10 ppb (6N grade), ≤1 ppb (7N grade)

Moisture Content

≤1 ppm (6N grade), ≤0.1 ppm (7N grade)

Product Grades & Application Matching

· 5N Grade (99.999%): Suitable for mature process chips (28nm and above), general material R&D, and industrial chemical synthesis. 9

· 6N Grade (99.9999%): Standard for 14-7nm advanced logic chips, standard HBM, and 200+ layer 3D NAND; meets the requirements of GB/T 32386-2026 national standard for electronic-grade WF₆. 4, 9

· 7N Grade (99.99999%): Exclusive for 3-2nm cutting-edge processes and high-end HBM; impurity control down to parts-per-billion level, currently only mass-produced by a limited number of global suppliers. 4, 6

Packaging & Shipping

· Cylinder Options: 10L, 20L, 40L, 44L, 47L, 50L certified specialty gas cylinders with ISO-compliant valve interfaces. 5

· Shipping Compliance: UN2196, Hazard Class 2.3 (Toxic Gas); full set of export documentation provided including COA, MSDS, and customs clearance support for global shipments. 1, 3

· Storage Requirements: Store in a cool, dry, ventilated area away from moisture and incompatible materials; stainless steel or Monel alloy valves are recommended for handling. 12, 14

Supply Advantage

As a trusted specialty gas supplier, we offer stable supply of high-purity WF₆ with batch-to-batch consistency guaranteed. Our products have passed certification from multiple international wafer fabs, with full traceability from raw material to finished product. For product specifications, sample requests, or export inquiries, please contact our sales team directly.





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