Electroplating Resist Dry Film

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Product Overview

Yingyue Electroplating Resist Dry Film is a high-performance photoresist solution specifically engineered for PCB pattern plating processes. Formulated with an advanced polymer adhesive and photopolymerizable monomer system, this dry film delivers exceptional resistance to acidic plating solutions (pH 3–6) and maintains structural integrity under prolonged exposure to elevated bath temperatures. Its strong adhesion to copper substrates ensures reliable edge definition and prevents undercutting or peeling during gold, nickel, or tin electroplating. The film features a wide process window for both lamination and exposure, ensuring consistent performance in high-volume manufacturing environments. After plating, it strips cleanly in sheet form without residue using mild alkaline solutions, leaving the substrate pristine for subsequent processing. With halogen content ≤900 ppm, it meets stringent environmental regulations for global markets. Yingyue’s proven formulation and technical expertise make this dry film an ideal choice for demanding applications including fine-pitch pattern plating, thick/hard gold deposition, and high-frequency PCB production.

Key Features

· Excellent Acid Resistance: Withstands prolonged exposure to acidic plating solutions at pH 3–6 without degradation, lifting, or undercutting. · High Temperature Stability: Maintains dimensional stability and adhesion in plating baths up to 60°C for extended durations. · Strong Adhesion: Achieves copper adhesion ≥0.5 N/cm, preventing edge lifting and ensuring precise pattern fidelity during electroplating. · Clean Stripping: Removes in intact sheets with no residue using 1–3% NaOH at 40–60°C, leaving a clean surface for post-plating processes. · Wide Process Window: Optimized lamination (100–125°C) and exposure (310–440 nm) parameters ensure consistent results across high-volume production lines. · Low Halogen Content: Halogen levels ≤900 ppm comply with RoHS, REACH, and other international environmental standards.

Typical Specifications

Applications

· Pattern Plating (Au/Ni/Sn) – Reliable resist for selective gold, nickel, and tin pattern plating on PCB conductors and pads. · Standard Gold Plating (≤4.0μm) – Ideal for connector contact plating and standard gold deposition processes. · Hard Gold / Thick Gold Plating – Engineered for demanding thick or hard gold plating requiring superior edge definition and wear resistance. · High-Frequency PCB Low-Halogen – Meets low-halogen requirements for high-frequency and high-reliability PCB applications. · EU Market Environmental Compliance – Fully compliant with EU environmental directives for seamless export and market access.

Available Grades

Why Choose Our Electroplating Resist Dry Film?

· Stable Supply Chain: Consistent batch-to-batch quality with reliable production capacity to support large-scale PCB manufacturing. · Export-Ready Documentation: Full COA, SDS, and export compliance documentation provided for smooth customs clearance worldwide. · Technical Support: Process optimization guidance and on-site application support available from our experienced team. · Samples Available: Free evaluation samples for R&D verification and process qualification.