PCB Dry Film Photoresist Series

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Product Overview

Yingyue’s PCB Dry Film Photoresist Series is a high-performance, acrylate-based photopolymer engineered for precision graphic transfer and circuit formation in advanced PCB manufacturing. Featuring a robust three-layer sandwich structure with PE/PET support films, this series delivers exceptional resolution down to 75μm, making it ideal for multilayer boards, HDI, and FPC applications. The formulation ensures superior adhesion to copper substrates and outstanding resistance to acidic and alkaline etchants as well as plating solutions. Designed for high-throughput production, it offers rapid development and stripping capabilities using standard aqueous solutions, significantly reducing processing time. With a wide exposure latitude and water-soluble, eco-friendly composition, Yingyue dry film photoresists provide reliable, consistent performance while supporting sustainable manufacturing practices. Trust Yingyue for high-resolution, dependable graphic transfer solutions tailored to modern PCB fabrication demands.

Key Features

· High Resolution & Fine Line Definition: Achieves resolution of ≤75μm, enabling precise graphic transfer for fine-pitch circuits and advanced HDI designs.

· Excellent Adhesion: Provides strong bonding to copper foil and various substrate surfaces, ensuring pattern integrity throughout etching and plating processes.

· Superior Etch Resistance: Withstands aggressive acidic and alkaline etchants as well as electroplating baths, maintaining film integrity during critical fabrication steps.

· Fast Development & De-rez: Enables rapid development and stripping with standard aqueous solutions, streamlining production cycles and improving throughput.

· Wide Exposure Window: Offers broad process latitude under UV exposure (310–440nm), ensuring consistent results across high-volume manufacturing runs.

· Water-Soluble & Eco-Friendly: Formulated with water-soluble chemistry for easy processing and reduced environmental impact, aligning with green manufacturing standards.

Typical Specifications

Applications

· Multilayer PCB Inner Layer Patterning – Precise graphic transfer for inner layer circuit formation in multilayer board manufacturing.

· Outer Layer Circuit Formation – Reliable resist performance for outer layer etching and circuit definition processes.

· HDI Board Fine Line Processing – High-resolution capability for fine-line and microvia applications in HDI substrates.

· Flexible PCB (FPC) Manufacturing – Flexible film compatibility for dynamic and rigid-flex PCB fabrication.

· Thick Copper PCB Fabrication – Robust adhesion and etch resistance for heavy copper boards (≥3oz copper thickness) in power electronics.

Available Grades

Why Choose Our PCB Dry Film Photoresist?

· Stable Supply Chain: Consistent batch-to-batch quality with reliable production capacity to support large-scale PCB manufacturing.

· Export-Ready Documentation: Full COA, SDS, and export compliance documentation provided for smooth customs clearance worldwide.

· Technical Support: Process optimization guidance and on-site application support available from our experienced team.

· Samples Available: Free evaluation samples for R&D verification and process qualification.